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[ CAS No. 1319736-15-6 ] {[proInfo.proName]}

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Chemical Structure| 1319736-15-6
Chemical Structure| 1319736-15-6
Structure of 1319736-15-6 * Storage: {[proInfo.prStorage]}
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Product Details of [ 1319736-15-6 ]

CAS No. :1319736-15-6 MDL No. :N/A
Formula : C45H32N4 Boiling Point : -
Linear Structure Formula :- InChI Key :JTVXUFJCXRDJSY-UHFFFAOYSA-N
M.W : 628.76 Pubchem ID :101961430
Synonyms :

Safety of [ 1319736-15-6 ]

Signal Word:Warning Class:
Precautionary Statements:P261-P280-P301+P312-P302+P352-P305+P351+P338 UN#:
Hazard Statements:H302-H315-H319-H335 Packing Group:
GHS Pictogram:

Application In Synthesis of [ 1319736-15-6 ]

* All experimental methods are cited from the reference, please refer to the original source for details. We do not guarantee the accuracy of the content in the reference.

  • Downstream synthetic route of [ 1319736-15-6 ]

[ 1319736-15-6 ] Synthesis Path-Downstream   1~9

  • 1
  • [ 7647-01-0 ]
  • copper(II) bis(tetrafluoroborate) [ No CAS ]
  • [ 1319736-15-6 ]
  • [ 33513-42-7 ]
  • Cu3Cl6(tetra(4-(4-pyridyl)phenyl)methane)2*6DMF [ No CAS ]
YieldReaction ConditionsOperation in experiment
In N,N-dimethyl-formamide High Pressure; Cu salt and ligand (2:1) in DMF with a small amount of aq.HCl, sealed, heated at 110°C; slowly cooled to room temp.;
  • 2
  • [ 7647-01-0 ]
  • copper(II) bis(tetrafluoroborate) [ No CAS ]
  • [ 1319736-15-6 ]
  • [ 33513-42-7 ]
  • CuCl2(tetra(4-(4-pyridyl)phenyl)methane)*6.5DMF [ No CAS ]
YieldReaction ConditionsOperation in experiment
In N,N-dimethyl-formamide High Pressure; Cu salt and ligand (1:1) in DMF with a small amount of aq.HCl, sealed, heated at 110°C; slowly cooled to room temp.;
  • 3
  • [ 7647-01-0 ]
  • copper(II) hexafluorophosphate [ No CAS ]
  • [ 1319736-15-6 ]
  • [ 33513-42-7 ]
  • Cu3Cl6(tetra(4-(4-pyridyl)phenyl)methane)2*6DMF [ No CAS ]
YieldReaction ConditionsOperation in experiment
In N,N-dimethyl-formamide High Pressure; Cu salt and ligand (2:1) in DMF with a small amount of aq.HCl, sealed, heated at 110°C; slowly cooled to room temp.;
  • 4
  • [ 7647-01-0 ]
  • copper(II) hexafluorophosphate [ No CAS ]
  • [ 1319736-15-6 ]
  • [ 33513-42-7 ]
  • CuCl2(tetra(4-(4-pyridyl)phenyl)methane)*6.5DMF [ No CAS ]
YieldReaction ConditionsOperation in experiment
In N,N-dimethyl-formamide High Pressure; Cu salt and ligand (1:1) in DMF with a small amount of aq.HCl, sealed, heated at 110°C; slowly cooled to room temp.;
  • 5
  • [ 254879-97-5 ]
  • [ 1319736-15-6 ]
  • (bis[4,4′-(trans-Pt(PEt3)2)]-diphenylmethanone)6(tetra(4-(4-pyridinyl)phenyl)methane)4(OTf)12 [ No CAS ]
YieldReaction ConditionsOperation in experiment
68% In dimethylsulfoxide-d6 at 20℃; for 24h;
  • 6
  • [ 1319736-15-6 ]
  • C19H35F3O3P2PtS(1+) [ No CAS ]
  • C117H172N4P8Pt4(4+)*4CF3O3S(1-) [ No CAS ]
YieldReaction ConditionsOperation in experiment
79% In dichloromethane at 50℃;
  • 7
  • [Cu4Br4(P(C6H5)3)4] [ No CAS ]
  • [ 1319736-15-6 ]
  • [ 67-68-5 ]
  • C45H32N4*2.3C2H6OS*2Cu(1+)*2Br(1-) [ No CAS ]
YieldReaction ConditionsOperation in experiment
50% at 110℃;
  • 8
  • [Cu4Br4(P(C6H5)3)4] [ No CAS ]
  • [ 1319736-15-6 ]
  • [ 67-68-5 ]
  • C45H32N4*C2H6OS*1.5H2O*2Cu(1+)*2Br(1-) [ No CAS ]
YieldReaction ConditionsOperation in experiment
69% at 180℃;
  • 9
  • [ 1319736-15-6 ]
  • [ 67-68-5 ]
  • copper(l) chloride [ No CAS ]
  • C45H32N4*H2O*C2H6OS*2Cu(1+)*2Cl(1-) [ No CAS ]
YieldReaction ConditionsOperation in experiment
23% Stage #1: dimethyl sulfoxide; copper(l) chloride at 90℃; for 1h; Stage #2: tetrakis(4-pyridyl)tetraphenylmethane at 180℃; for 1h; Schlenk technique; Inert atmosphere;
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